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Machine tools
ND660
Wafer manufacturing equipment
- Max workpiece size (D x L x No.) (in) Φ26 x L20 x 1pc
- Max workpiece size (D x L x No.) (mm) Φ660 x L500 x 1pc
- Processing method Diamond wire
- Machine size (W x D x H) (in) 94.5 x 185.0 x 133.9
- Machine size (W x D x H) (mm) 2,400 x 4,700 x 3,400
Purchase options
Contact usDedicated diamond wire machine for large-diameter workpieces
Capable of processing large-diameter workpieces up to Φ660mm, and active in the quartz substrate for LCD and semiconductor target substrate industries.
- Diamond wire adoption
- Wafer thickness can be changed
- Reduction of running costs
Resources
Features and benefits
Diamond wire specialized machine
High-speed machining is possible by adopting a fixed abrasive processing method using diamond wire. High productivity is also achieved by the high speed wire running speed. Reduction of kerf loss by thinner wire. Material yield is improved. Since slurry (loose abrasive) is not used, waste liquid treatment is not required, which is environmentally friendly and reduces treatment costs.
Cutting thickness can be changed
Optional wire-skipping mechanism can be attached to accommodate cutting thicknesses up to 80 mm.
Reduction of running costs
Tension control and wire path optimization reduce the number of guide rollers, thereby reducing wire usage and the risk of wire breakage.
Specifications
- Full specs
- Wire running method: Uni-directional/bi-directional/switchable
- Max wire speed (ft/min): 4265
- Max wire speed (m/min): 1300
- Tension range (N): 35-120
- Wire storage capacity: Φ0.35mm × 5.5km
- Cutting feed speed (in/min): 0.004-0.12
- Cutting feed speed (mm/min): 0.1-3.0
- Power source used: 480V ± 10%
- Power consumption (kVA): 115
- Compressed air used: 600NL / min, 0.4MPa min
- Equipped NC: FANUC
- Machine size (W x L x H) (mm): 2,400 x 4,700 x 3,400
- Machine size (W x L x H) (in): 94.5 x 185.0 x 133.9
- Machine weight (kg): 22000
- Machine weight (lbs): 48502
- Specialties: Wire saw