We are capable of processing silicon ingots and other materials such as quartz and crystal, and have supplied numerous wafer fabrication equipment to the semiconductor, solar cell, and LCD industries. The wire saw machine ensures high rigidity and static accuracy, and minimizes wafer waviness by utilizing tension control and thermal control technologies developed over many years. Stable, high-precision machining reduces post-process work, and fine wire reduces material loss during machining. The fine wire reduces material loss during processing, improves yield, and brings high productivity to the customer's production line.