Purchase options
Contact usThe MWM442DM multi-wire saw was designed for slicing semiconductor wafers and solar cell wafers as well as wafers of a small diameter. The MWM442DM is easy to use because of its compact design and is considered one of our best-selling machines.
The industry's smallest class compact machine designed for easy handling of small workpieces. It saves space and energy, and contributes to lower maintenance and management costs at factories.
Wire running can be switched between unidirectional and bidirectional. The running method can be selected according to the required quality. Tooling can be selected to suit the workpiece, such as Φ100 x 3 cutting or Φ200 x 1 cutting.
Workpieces can be set in parallel and machined simultaneously. High productivity is realized in spite of its compact size.