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Machine tools

MWM3050nQ

Wafer manufacturing equipment

  • Max workpiece size (D x L x No.) (in) Φ11.8 x L17.7 x 1pc
  • Max workpiece size (D x L x No.) (mm) Φ300 x L450 x 1pc
  • Processing method Slurry
  • Machine size (W x D x H) (in) 78.7 x 139.8 x 137.8
  • Machine size (W x D x H) (mm) 2,000 x 3,550 x 3,500

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Delivers stable, high‑precision processing for superior quality

A 12‑inch wafer wire saw with a proven track record in the semiconductor substrate industry, where the highest quality standards are required

  • High‑rigidity design
  • Integrated thermal control mechanism

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Features and benefits

Pursuit of high rigidity and high straightness

The machine rigidity is improved by FEM analysis to reduce machine deformation due to machining load and enable stable machining. High straightness is achieved by adopting a linear guide that can withstand high loads and eliminating minute waviness.

Thermal control mechanism

Temperature sensors and cooling mechanisms are installed in the spindle unit and main roller. By arbitrarily controlling the spindle temperature during machining, thermal deformation of the machine, which affects machining accuracy, can be suppressed and machined shapes can be stabilized.


Specifications

Metric Imperial (US)
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  • Wire running method: Uni-directional/bi-directional/switchable
  • Max wire speed (ft/min): 3281
  • Max wire speed (m/min): 1000
  • Tension range (N): 15-34
  • Wire storage capacity: Φ0.14mm × 500km
  • Cutting feed speed (in/min): 0.0004-0.98
  • Cutting feed speed (mm/min): 0.01-2.50
  • Power source used: 200V ± 10%
  • Power consumption (kVA): 115
  • Compressed air used: 600NL / min, 0.4MPa min
  • Equipped NC: FANUC
  • Machine size (W x L x H) (mm): 2,000 x 3,550 x 3,500
  • Machine size (W x L x H) (in): 78.7 x 139.8 x 137.8
  • Machine weight (kg): 14700
  • Machine weight (lbs): 32408
  • Max workpiece size (D x L x No.) (in): Φ11.8 x L17.7 x 1pc
  • Max workpiece size (D x L x No.) (mm): Φ300 x L450 x 1pc
  • Specialties: Wire saw