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Machine tools

MWM15413

Wafer manufacturing equipment

  • Max workpiece size (D x L x No.) (in) 63.4 x 55.5 x L13.8 x 1 unit
  • Max workpiece size (D x L x No.) (mm) 1,610 x 1,410 x L350 x 1 unit
  • Processing method Slurry
  • Machine size (W x D x H) (in) 216.5 x 354.3 x 215.7
  • Machine size (W x D x H) (mm) 5,500 x 9,000 x 5,480

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Multi-wire saw for large workpieces

Wire cutting of large workpieces of more than 1 m square, such as LCD mask substrates

  • High production and high quality
  • Comfortable maintainability

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Features and benefits

High productivity and high quality

Compared with band saws, kerf loss is reduced, and productivity is improved by reducing material loss. Improved accuracy of machined parts by minimizing flatness and thickness variation.

Ensures accessibility and maintainability

Sliding doors are used on the front and both side covers to improve accessibility to the workpiece cutting area and facilitate maintenance. Bobbins can be replaced without the use of a lifter using the jib crane attached to the machine body (optional).


Specifications

Metric Imperial (US)
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  • Wire running method: Uni-directional/bi-directional/switchable
  • Max wire speed (ft/min): 2625
  • Max wire speed (m/min): 800
  • Tension range (N): 25-100
  • Wire storage capacity: Φ0.32mm x 300km
  • Cutting feed speed (in/min): 0.0008-0.098
  • Cutting feed speed (mm/min): 0.02-2.5
  • Power source used: 200V ± 10%
  • Power consumption (kVA): 96
  • Compressed air used: 600NL / min, 0.4MPa
  • Equipped NC: FANUC
  • Machine size (W x L x H) (mm): 5,500 x 9,000 x 5,480
  • Machine size (W x L x H) (in): 216.5 x 354.3 x 215.7
  • Machine weight (kg): 40000
  • Machine weight (lbs): 88185
  • Max workpiece size (D x L x No.) (in): 63.4 x 55.5 x L13.8 x 1 unit
  • Max workpiece size (D x L x No.) (mm): 1,610 x 1,410 x L350 x 1 unit