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Machine tools
Wafer inspection equipment
Image processing equipment
- Process Surface and internal inspection
- Inspection target Silicon wafers (semiconductors, solar cells)
- Function Crack detection, stain detection
Purchase options
Contact usFully automated wafer inspection system for labor saving and quantitative evaluation
- Consolidation of inspection processes
- Excellent inspection capabilities
- Equipped with NTC software
- Improved usability
Resources
Features and benefits
Consolidation of inspection processes
The combination of automatic transfer and image processing covers many of the wafer inspection items on a single machine. It reduces the number of machines and saves space. Capable of performing multiple inspections including dimensional measurement, defect detection such as chips, pinholes, and foreign matter, as well as waviness and plate thickness measurement.
Equipped with NTC software
High-speed processing of image inspections is realized through the practical application of parallel image processing using proprietary software. 20 items can be inspected and discharged in 20 seconds/page. Reduces CPU operating load. Reduces heat generation, prevents hardware deterioration, and contributes to lower running costs through power savings.
Excellent inspection capabilities
Special optics effectively eliminate patterns and adhering objects that interfere with inspection, ensuring that only defects are detected. The outer edge of the wafer, which was considered an uninspected area, is now inspected. In addition to wafer thickness and soermark, the laser sensor can also be used to measure resistivity and determine PN with optional equipment.
Improved usability
To prepare for inspection, simply load the workpiece into the cassette loader. Pressing the start button starts the inspection with fully-automatic conveyance, and OK and NG workpieces are sorted and discharged. OK/NG judgment, NG type, and various measurement data can be checked in real time on the operation screen. Images and detailed data can be retrieved at any time. Establishing traceability supports yield improvement.
Specifications
- Full specs
- Machine size (W x L x H) (in): 141.7 x 47.2 x 74.8 (Machine size may differ from the description depending on inspection items.)
- Machine size (W x L x H) (mm): 3,600 x 1,200 x 1,900 (Machine size may differ from the description depending on inspection items.)
- Max workpiece size (in): Φ11.8
- Max workpiece size (mm): Φ300
- Inspection item: O.D. and corner dimensions, chipping/chipping, cotton stains on front and back, through/non-through cracks, pinholes, foreign matter, plate thickness, waviness/warping, soakmark, resistivity/PN judgment, life time, et cetera. Inspection items not listed can be tailor-made.